Yue Yuan is tackling the limitations in advanced electronic circuits using 2D materials by introducing a groundbreaking fabrication technique. By transferring multilayer hexagonal boron nitride onto silicon microchips, Yue Yuan achieves high-integration-density 2D-CMOS hybrid microchips for memristive applications, representing a notable advance in performance and technology readiness.
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Breaking the Wall of Energy-Hungry Electronics
Yue Yuan is a PhD student of Material Science and Engineering at the King Abdullah University of Science and Technology. She is currently working on the study of 2D materials, such as hexagonal boron nitride. Yue Yuan has experience in the fabrication and characterisation of 2D-materials-based devices, particularly in the Conductive Atomic Force Microscopy (CAFM), 2D Material Transfer Stage, and Focus Ion Beam (FIB).
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