Huiming Bu was talking about humanity’s attempts to keep up with and surpass Moore’s law. In IBM’s case, that entails decreasing the size of chips while increasing their performance and energy consumption. Stacking the chips on a three dimensional plane will improve their efficiency and power the next generations of devices, from mobile phones to autonomous cars.
Falling Walls
Falling Walls Science Summit 2022
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Falling Walls Conversation with Huiming Bu
Huiming Bu
Engineering & Technology
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